Package parameters/number of pins: 1140
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/EU RoHS: Not Compliant
Other/Product Category: Aggregation and Channelizer
Other/Maximum Data Rate: 10Gbps
Other/Counting: Surface Mount
Other/PCB changed: 1140
Other/Supplier Package: HL-BGA
Other/Pin Count: 1140
Compliant with standards/RoHS standards: Non-Compliant
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