Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 532
Encapsulation parameters/Encapsulation: FCBGA
External dimensions/packaging: FCBGA
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TMS32C6414EZLZ5E0
|
TI | 功能相似 | FCBGA-532 |
定点数字信号处理器 FIXED-POINT DIGITAL SIGNAL PROCESSORS
|
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