Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DG302AK
|
Maxim Integrated | 功能相似 | DIP |
TTL兼容的CMOS模拟开关 TTL Compatible CMOS Analog Switches
|
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