Technical parameters/number of circuits: 1
Technical parameters/number of pins: 28
Technical parameters/dissipated power: 1000 mW
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 1 W
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: SOIC-28
External dimensions/length: 18.1 mm
External dimensions/width: 7.6 mm
External dimensions/height: 2.35 mm
External dimensions/packaging: SOIC-28
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Each
Other/Manufacturing Applications: Signal Processing, Portable Devices, Communications&Networking, Communications&Networking, Portable Devices
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DG406DYZ
|
Xicor | 类似代替 | SOIC |
INTERSIL DG406DYZ 芯片, 16通道 模拟多路复用器
|
||
|
|
Harris | 类似代替 |
INTERSIL DG406DYZ 芯片, 16通道 模拟多路复用器
|
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