Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 456
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Applied Micro | 功能相似 | BGA |
MPU 440EP RISC 16Bit 0.13um 533MHz 3.3V 456Pin EBGA Tray
|
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