Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX3089CPD+
|
Dallas Semiconductor | 功能相似 |
MAXIM INTEGRATED PRODUCTS MAX3089CPD+. 总线, CAN, 收发器, 4.75 V, 5.25 V, DIP
|
|||
MAX3089CPD+
|
Maxim Integrated | 功能相似 | DIP-14 |
MAXIM INTEGRATED PRODUCTS MAX3089CPD+. 总线, CAN, 收发器, 4.75 V, 5.25 V, DIP
|
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