Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSOP
External dimensions/packaging: TSOP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
K4H561638B-TLA0
|
Samsung | 功能相似 | TSOP |
128Mb DDR SDRAM
|
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