Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 10
Encapsulation parameters/Encapsulation: HVSON
External dimensions/packaging: HVSON
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX16903RAUE33+
|
Maxim Integrated | 功能相似 | TSSOP-16 |
降压型 Vin=3.5V~28V Vout=3.3V 1A
|
||
|
|
Maxim Integrated | 功能相似 | TSSOP-16 |
降压型 Vin=3.5V~28V Vout=5V 1A
|
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