Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOP-8
External dimensions/packaging: SOP-8
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
FM25H20-DG
|
Ramtron | 完全替代 | TDFN |
CYPRESS SEMICONDUCTOR FM25H20-DG 芯片, 存储器, FRAM, 2MB, SPI, 3V, 40MHz, TDFN8
|
||
FM25H20-G
|
Cypress Semiconductor | 完全替代 | SOIC-8 |
2MB串行3V F-RAM存储器 2Mb Serial 3V F-RAM Memory
|
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