Technical parameters/power supply voltage: 2.4V ~ 2.6V
Package parameters/number of pins: 208
Encapsulation parameters/Encapsulation: LFBGA-208
External dimensions/length: 15.0 mm
External dimensions/width: 15.0 mm
External dimensions/packaging: LFBGA-208
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
70T3319S166BC
|
Integrated Device Technology | 类似代替 | CABGA-256 |
256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's
|
||
70V3319S166PRFG
|
Integrated Device Technology | 功能相似 | TQFP-128 |
Dual-Port SRAM, 256KX18, 3.6ns, CMOS, PQFP128, 14 X 20MM X 1.4MM, GREEN, PLASTIC, TQFP-128
|
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