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Technical parameters/dissipated power (Max): 800 mW
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-39
External dimensions/packaging: TO-39
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Microsemi | 功能相似 |
STMICROELECTRONICS BF259 单晶体管 双极, NPN, 300 V, 90 MHz, 5 W, 100 mA, 25 hFE
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BF259
|
CDIL | 功能相似 |
STMICROELECTRONICS BF259 单晶体管 双极, NPN, 300 V, 90 MHz, 5 W, 100 mA, 25 hFE
|
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BF259
|
Multicomp | 功能相似 | TO-39 |
STMICROELECTRONICS BF259 单晶体管 双极, NPN, 300 V, 90 MHz, 5 W, 100 mA, 25 hFE
|
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BF259
|
Semelab | 功能相似 | TO-39 |
STMICROELECTRONICS BF259 单晶体管 双极, NPN, 300 V, 90 MHz, 5 W, 100 mA, 25 hFE
|
||
|
BF259G4
|
Semelab | 功能相似 | BCY |
100mA, 300V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-205AD, HERMETIC SEALED, METAL, TO-39, 3 PIN
|
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