Technical parameters/dissipated power: 2.4 W
Technical parameters/rise time: 29 ns
Technical parameters/descent time: 60 ns
Technical parameters/operating temperature (Max): 150 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/dissipated power (Max): 2.4 W
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC
External dimensions/length: 4.9 mm
External dimensions/width: 3.9 mm
External dimensions/height: 1.575 mm
External dimensions/packaging: SOIC
Physical parameters/operating temperature: -55℃ ~ 175℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
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