Technical parameters/RAM size: 64 KB
Technical parameters/FLASH memory capacity: 256 KB
Technical parameters/operating temperature (Max): 100 ℃
Technical parameters/operating temperature (Min): -40 ℃
Package parameters/number of pins: 896
Encapsulation parameters/Encapsulation: FBGA-896
External dimensions/packaging: FBGA-896
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M2S050-1FG896I
|
Microsemi | 完全替代 | FBGA-896 |
FPGA SmartFusion2 Family 48672 Cells 65nm Technology 1.2V 896Pin FBGA
|
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