Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 1.7V ~ 1.9V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: FBGA-165
External dimensions/height: 0.89 mm
External dimensions/packaging: FBGA-165
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C1512AV18-167BZC
|
Cypress Semiconductor | 完全替代 | FBGA-165 |
72 - Mbit的QDR ™-II SRAM 2字突发架构 72-Mbit QDR⑩-II SRAM 2-Word Burst Architecture
|
||
CY7C1512AV18-167BZI
|
Cypress Semiconductor | 类似代替 | FBGA-165 |
72 - Mbit的QDR - II SRAM的2字突发架构 72-Mbit QDR-II SRAM 2-Word Burst Architecture
|
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