Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Artesyn Embedded Technologies | 类似代替 | DIP-9 |
CONV DC-DC OPEN FRM 12V OUT 50W
|
||
EXB50-48S12
|
Emerson | 类似代替 | DIP |
CONV DC-DC OPEN FRM 12V OUT 50W
|
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