Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 3.3 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: FBGA
External dimensions/height: 0.89 mm
External dimensions/packaging: FBGA
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 功能相似 | BGA |
18兆位( 512K的× 36/1米× 18 )流水线式SRAM 18-Mbit (512 K × 36/1 M × 18) Pipelined SRAM
|
||
CY7C1380F-167BZI
|
Cypress Semiconductor | 功能相似 | LBGA-165 |
18兆位( 512K的× 36/1米× 18 )流水线式SRAM 18-Mbit (512 K × 36/1 M × 18) Pipelined SRAM
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review