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Description 1818 Mbit DDR II SRAM Two Word Burst Architecture
Product QR code
Packaging FBGA-165
Delivery time
Packaging method Tray
Standard packaging quantity 1
75.7  yuan 75.7yuan
1+:
$ 87.0562
10+:
$ 83.2711
100+:
$ 82.5898
250+:
$ 82.0599
500+:
$ 81.2272
1000+:
$ 80.8487
2500+:
$ 80.3188
5000+:
$ 79.8646
Quantity
1+
10+
100+
250+
500+
Price
$87.0562
$83.2711
$82.5898
$82.0599
$81.2272
Price $ 87.0562 $ 83.2711 $ 82.5898 $ 82.0599 $ 81.2272
Start batch production 1+ 10+ 100+ 250+ 500+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(8778) Minimum order quantity(1)
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Technical parameters/digits: 36

Technical parameters/access time: 0.45 ns

Technical parameters/access time (Max): 0.45 ns

Technical parameters/operating temperature (Max): 70 ℃

Technical parameters/operating temperature (Min): 0 ℃

Technical parameters/power supply voltage: 1.7V ~ 1.9V

Technical parameters/power supply voltage (Max): 1.9 V

Technical parameters/power supply voltage (Min): 1.7 V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 165

Encapsulation parameters/Encapsulation: FBGA-165

External dimensions/packaging: FBGA-165

Physical parameters/operating temperature: 0℃ ~ 70℃

Other/Product Lifecycle: Unknown

Other/Packaging Methods: Tray

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: lead-free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
CY7C1320KV18-300BZXC CY7C1320KV18-300BZXC Cypress Semiconductor 完全替代 FBGA-165
18兆位的DDR II SRAM双字突发架构 18-Mbit DDR II SRAM Two-Word Burst Architecture
PDF
CY7C1320KV18-333BZC CY7C1320KV18-333BZC Cypress Semiconductor 完全替代 LBGA-165
18兆位的DDR II SRAM双字突发架构 18-Mbit DDR II SRAM Two-Word Burst Architecture
PDF

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