Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Aftermarket
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C1354A-133BGI
|
Cypress Semiconductor | 功能相似 | BGA |
256K ×36 / 512K ×18的SRAM流水线与NoBL⑩架构 256K x 36/512K x 18 Pipelined SRAM with NoBL⑩ Architecture
|
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