Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BXB100-48S05FLTJ
|
Astec Power | 完全替代 |
Module DC-DC 48Vin 1Out 5V 20A 100W 9Pin Half-Brick
|
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