Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TFSOP-10
External dimensions/packaging: TFSOP-10
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube
Other/Manufacturing Applications: Fiber optic network
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY88843VEY
|
Microchip | 功能相似 | MSOP-10 |
IC AMP POST PECL 3.3V/5V 10-MSOP
|
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