Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 40 ℃
Technical parameters/power supply voltage: 1.425V ~ 1.575V
Technical parameters/power supply voltage (Max): 1.575 V
Technical parameters/power supply voltage (Min): 1.425 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 484
Encapsulation parameters/Encapsulation: FBGA-484
External dimensions/length: 23 mm
External dimensions/width: 23 mm
External dimensions/height: 1.73 mm
External dimensions/packaging: FBGA-484
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AX500-2FG484I
|
Microsemi | 类似代替 | FBGA-484 |
FPGA Axcelerator Family 286K Gates 5376 Cells 870MHz 0.15um Technology 1.5V 484Pin FBGA
|
||
AX500-2FG484I
|
SOC | 类似代替 | BGA-484 |
FPGA Axcelerator Family 286K Gates 5376 Cells 870MHz 0.15um Technology 1.5V 484Pin FBGA
|
||
AX500-2FGG484
|
Microsemi | 类似代替 | FBGA-484 |
FPGA - 现场可编程门阵列 AX500-2FGG484 LEAD FREE
|
||
AX500-FG484
|
Microsemi | 类似代替 | FBGA-484 |
FPGA Axcelerator Family 286K Gates 5376 Cells 649MHz 0.15um Technology 1.5V 484Pin FBGA
|
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