Technical parameters/Contact electroplating: Gold
Technical parameters/insulation resistance: 1000 MΩ
Encapsulation parameters/installation method: Solder
Physical parameters/contact material: Brass
Physical parameters/materials: Brass
Physical parameters/medium materials: Teflon
Physical parameters/insulation material: Teflon
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
16MMCX-50-2-1/111OE
|
Suhner | 完全替代 |
HUBER & SUHNER 16MMCX-50-2-1/111OE 射频/同轴连接器, MMCX同轴, 直角插头, 焊接, 50 ohm, RG405, 青铜
|
|||
16MMCX-50-2-1/111OE
|
Huber & Suhner | 完全替代 |
HUBER & SUHNER 16MMCX-50-2-1/111OE 射频/同轴连接器, MMCX同轴, 直角插头, 焊接, 50 ohm, RG405, 青铜
|
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