Technical parameters/Resistance (DC): ≤49.5 mΩ
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: Nonstandard
External dimensions/packaging: Nonstandard
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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