Technical parameters/inductance: 32.63 µH
Technical parameters/inductance tolerance: ±20 %
Technical parameters/Resistance (DC): ≤285.5 mΩ
Technical parameters/rated current (DC): 1.3 A
Technical parameters/resistance (DC Max): 0.146 Ω
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 4
Encapsulation parameters/Encapsulation: SMD
External dimensions/length: 13.97 mm
External dimensions/width: 8.89 mm
External dimensions/height: 5.97 mm
External dimensions/packaging: SMD
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CTX33-3P
|
Eaton Bussmann | 功能相似 |
Inductor Power Wirewound 32.63uH/130.54uH 20% 100kHz Powdered Iron 1.3A/0.65A 146mOhm/571mOhm DCR T/R
|
|||
CTX33-3P
|
Cooper Bussmann | 功能相似 |
Inductor Power Wirewound 32.63uH/130.54uH 20% 100kHz Powdered Iron 1.3A/0.65A 146mOhm/571mOhm DCR T/R
|
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