Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PGA2310PA
|
TI | 功能相似 | PDIP-16 |
TEXAS INSTRUMENTS PGA2310PA 音频控制器, 音量, ± 4.5V 至 ± 15V, SPI, DIP, 16 引脚, -40 °C
|
||
PGA2311PA
|
National Semiconductor | 功能相似 | PDIP |
TEXAS INSTRUMENTS PGA2311PA 音频控制器, 音量, ± 4.75V 至 ± 5.25V, SPI, DIP, 16 引脚, -40 °C
|
||
PGA2311U
|
TI | 功能相似 | SOIC-16 |
TEXAS INSTRUMENTS PGA2311U 音频功率放大器, 2通道, ± 4.75V 至 ± 5.25V, SOIC, 16 引脚
|
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