Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP-28
External dimensions/packaging: DIP-28
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT7200L25J8
|
Integrated Device Technology | 功能相似 | PLCC-32 |
IC MEM FIFO 256X9 25NS 32-PLCC
|
||
IDT7200L25JI
|
Integrated Device Technology | 功能相似 | LCC-32 |
IC MEM FIFO 256X9 25NS 32-PLCC
|
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