Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/packaging: BGA-256
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
EPM7512BFC256-10N
|
Altera | 功能相似 | BGA |
EE PLD, 5.5ns, 512-Cell, CMOS, PBGA256, FBGA-256
|
||
|
|
Altera | 功能相似 | BGA |
CPLD MAX 7000B Family 10K Gates 512 Macro Cells 119MHz 2.5V 256Pin FBGA
|
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