Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/packaging: BGA-256
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Not Recommended
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 类似代替 | FBGA-256 |
可编程逻辑器件(CPLD/FPGA) EPM3512AFI256-10 FBGA-256
|
||
EPM7512AEFC256-12
|
Intel | 完全替代 | BGA |
CPLD MAX 7000A Family 10K Gates 512 Macro Cells 71.9MHz 3.3V 256Pin FBGA
|
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