Technical parameters/frequency: 2314.8 MHz
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 0 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 324
Encapsulation parameters/Encapsulation: FBGA-324
External dimensions/packaging: FBGA-324
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
EPM2210F324C3N
|
Altera | 类似代替 | FBGA-324 |
Flash PLD, 7ns, 1700-Cell, CMOS, PBGA324, 19 X 19MM, 1MM PITCH, LEAD FREE, FBGA-324
|
||
EPM2210F324I5
|
Altera | 功能相似 | FBGA-324 |
Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA324, 19 X 19MM, 1MM PITCH, FBGA-324
|
||
|
|
Intel | 类似代替 | BGA-324 |
CPLD MAX II Family 1700 Macro Cells 201.1MHz 0.18um Technology 2.5V/3.3V 324Pin FBGA
|
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