Technical parameters/frequency: 125 MHz
Technical parameters/number of circuits: 1728
Technical parameters/RAM size: 12288 b
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 3.3 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 356
Encapsulation parameters/Encapsulation: BGA-356
External dimensions/height: 1.1 mm
External dimensions/packaging: BGA-356
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A991
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
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Intel | 类似代替 | LBGA |
FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 246 IOs
|
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