Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 0 ℃
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
EPF6024ABC256-2
|
Intel | 类似代替 | BGA |
可编程逻辑器件(CPLD/FPGA) EPF6024ABC256-2 BGA-256
|
||
EPF6024ABC256-2
|
Altera | 类似代替 | BGA-256 |
可编程逻辑器件(CPLD/FPGA) EPF6024ABC256-2 BGA-256
|
||
|
|
Intel | 类似代替 | BGA |
FPGA - 现场可编程门阵列 FPGA - Flex 6000 196 LABs 218 IOs
|
||
EPF6024ABC256-3
|
Altera | 类似代替 | BGA-256 |
FPGA - 现场可编程门阵列 FPGA - Flex 6000 196 LABs 218 IOs
|
||
|
|
Intel | 功能相似 | QFP |
FPGA - 现场可编程门阵列 FPGA - Flex 6000 196 LABs 171 IOs
|
||
EPF6024AQC208-3N
|
Altera | 功能相似 | QFP-208 |
FPGA - 现场可编程门阵列 FPGA - Flex 6000 196 LABs 171 IOs
|
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