Technical parameters/RAM size: 1105920 b
Technical parameters/operating temperature (Max): 100 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 1.16V ~ 1.24V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 324
Encapsulation parameters/Encapsulation: FBGA-324
External dimensions/height: 1 mm
External dimensions/packaging: FBGA-324
Physical parameters/operating temperature: -40℃ ~ 100℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A991
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
EP4CGX30CF19C6
|
Altera | 完全替代 | FBGA-324 |
FPGA Cyclone® IV GX Family 29440 Cells 60nm Technology 1.2V 324Pin TFBGA
|
||
EP4CGX30CF19C7N
|
Altera | 功能相似 | FBGA-324 |
IC FPGA 150 I/O 324FBGA
|
||
EP4CGX30CF19C8N
|
Altera | 类似代替 | FBGA-324 |
IC FPGA 150 I/O 324FBGA
|
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