Technical parameters/power supply voltage: 0.87V ~ 0.93V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 780
Encapsulation parameters/Encapsulation: BBGA-780
External dimensions/packaging: BBGA-780
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
EP4SGX180DF29C2XN
|
Altera | 类似代替 | FBGA-780 |
FPGA - 现场可编程门阵列 FPGA - Stratix IV GX 7030 LABs 372 IOs
|
||
EP4SGX180DF29C2XN
|
Intel | 类似代替 | BGA |
FPGA - 现场可编程门阵列 FPGA - Stratix IV GX 7030 LABs 372 IOs
|
||
EP4SGX180DF29C4N
|
Intel | 类似代替 | BGA |
FPGA Stratix IV GX Family 175750 Cells 40nm Technology 0.9V 780Pin FC-FBGA
|
||
EP4SGX180DF29I4
|
Altera | 类似代替 | FBGA-780 |
FPGA Stratix® IV GX Family 175750 Cells 40nm Technology 0.9V 780Pin FC-FBGA
|
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