Technical parameters/frequency: 600 MHz
Technical parameters/RAM size: 2184192 b
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.1 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 780
Encapsulation parameters/Encapsulation: FBGA-780
External dimensions/height: 2.55 mm
External dimensions/packaging: FBGA-780
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
EP3SE50F780C4
|
Altera | 类似代替 | FBGA-780 |
FPGA Stratix® III E Family 47500 Cells 450MHz 65nm Technology 1.1V 780Pin FC-FBGA
|
||
EP3SL50F780C3
|
Altera | 类似代替 | FBGA-780 |
FPGA Stratix® III L Family 47500 Cells 500MHz 65nm Technology 1.1V 780Pin FC-FBGA
|
||
|
|
Intel | 类似代替 | BGA |
FPGA Stratix® III L Family 47500 Cells 500MHz 65nm Technology 1.1V 780Pin FC-FBGA
|
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