Technical parameters/frequency: 500 MHz
Technical parameters/RAM size: 3565158.4 b
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 0.87V ~ 0.93V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 572
Encapsulation parameters/Encapsulation: FBGA-572
External dimensions/length: 25 mm
External dimensions/width: 25 mm
External dimensions/height: 1.5 mm
External dimensions/packaging: FBGA-572
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Each
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A991
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 完全替代 | BGA |
FPGA Arria® II GX Family 42959 Cells 500MHz 40nm Technology 0.9V 572Pin FC-FBGA
|
||
EP2AGX45DF25C5
|
Altera | 完全替代 | BGA-572 |
FPGA Arria® II GX Family 42959 Cells 500MHz 40nm Technology 0.9V 572Pin FC-FBGA
|
||
EP2AGX45DF25C6
|
Altera | 完全替代 | FBGA-572 |
FPGA Arria® II GX Family 42959 Cells 400MHz 40nm Technology 0.9V 572Pin FC-FBGA
|
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