Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.425V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 672
Encapsulation parameters/Encapsulation: FBGA-672
External dimensions/packaging: FBGA-672
Physical parameters/operating temperature: 0℃ ~ 85℃
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 完全替代 | BGA |
Loadable PLD, 1.69ns, CMOS, PBGA672, 27 X 27MM, 1MM PITCH, FINE LINE, BGA-672
|
||
|
|
Intel | 完全替代 | BGA |
FPGA - 现场可编程门阵列 CPLD - APEX II 1664 Macro 492 IOs
|
||
EP2A15F672C7N
|
Altera | 完全替代 | FBGA-672 |
FPGA - 现场可编程门阵列 CPLD - APEX II 1664 Macro 492 IOs
|
||
EP2A15F672C9N
|
Altera | 完全替代 | FBGA-672 |
FPGA - 现场可编程门阵列 CPLD - APEX II 1664 Macro 492 IOs
|
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