Technical parameters/power supply voltage: 0.87V ~ 0.93V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 572
Encapsulation parameters/Encapsulation: FBGA-572
External dimensions/packaging: FBGA-572
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 完全替代 | FBGA |
FPGA Arria II GX Family 60214 Cells 500MHz 40nm Technology 0.9V 572Pin FC-FBGA
|
||
|
|
Intel | 完全替代 | FBGA |
FPGA - 现场可编程门阵列 FPGA - Arria II GX 2530 LABs 252 IOs
|
||
EP2AGX65DF25I3N
|
Altera | 完全替代 | FBGA-572 |
FPGA - 现场可编程门阵列 FPGA - Arria II GX 2530 LABs 252 IOs
|
||
|
|
Intel | 完全替代 | BGA |
FPGA - 现场可编程门阵列 FPGA - Arria II GX 2530 LABs 252 IOs
|
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