Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/length: 5.1 mm
External dimensions/width: 4.5 mm
External dimensions/height: 0.95 mm
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LV595PW,118
|
Nexperia | 类似代替 | TSSOP-16 |
NXP 74LV595PW,118 移位寄存器, LV系列, 串行至并行、串行至串行, 1元件, TSSOP, 16 引脚, 1 V, 3.6 V
|
||
SN74LV595APWR
|
TI | 功能相似 | TSSOP-16 |
TEXAS INSTRUMENTS SN74LV595APWR 移位寄存器, LV系列, 串行至并行, 1元件, TSSOP, 16 引脚, 2 V, 5.5 V
|
||
SN74LV595APWR
|
TI | 功能相似 | TSSOP-16 |
TEXAS INSTRUMENTS SN74LV595APWR 移位寄存器, LV系列, 串行至并行, 1元件, TSSOP, 16 引脚, 2 V, 5.5 V
|
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