Technical parameters/gain: 3.2 dBi
Encapsulation parameters/installation method: Panel
Encapsulation parameters/Encapsulation: -
External dimensions/packaging: -
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: CDMA,HSPA,GPRS,GSM,LTE,UMTS
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
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