Technical parameters/Contact electroplating: Silver
Technical parameters/direction: Vertical
Technical parameters/contact type: SPST-NO
Encapsulation parameters/installation method: Through Hole
External dimensions/length: 11.3 mm
External dimensions/width: 10.3 mm
Physical parameters/operating temperature: -25℃ ~ 70℃
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review