Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SSOP
External dimensions/packaging: SSOP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY74FCT16823ATPACT
|
TI | 功能相似 | TFSOP-56 |
18位寄存器 18-Bit Registers
|
||
SN74ABT16823DL
|
TI | 功能相似 | SSOP-56 |
18位总线接口触发器具有三态输出 18-BIT BUS-INTERFACE FLIP-FLOPS WITH 3-STATE OUTPUTS
|
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