Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP-14
External dimensions/packaging: DIP-14
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLV2304IN
|
TI | 功能相似 | PDIP-14 |
家庭纳安级功耗运算放大器和开漏比较器 FAMILY OF NANOPOWER OPERATIONAL AMPLIFIERS AND OPEN DRAIN COMPARATORS
|
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