Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HM6264BLP-10L
|
HITACHI | 功能相似 | DIP |
SRAM Chip Async Single 5V 64Kbit 8K x 8 100ns 28Pin PDIP
|
||
|
|
Epson Electronics | 功能相似 | DIP |
Standard SRAM, 8KX8, 100ns, CMOS, PDIP28
|
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