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Model ECLAMP0501T.TCT
Description Clamp™ Transient voltage suppressor, used for ESD protection, Semtech Semtech series μ Clamp ™ The transient voltage suppressor diode can prevent overvoltage from damaging sensitive electronic components. Due to the use of compact packaging, μClamp ™ Transient voltage suppressor diodes are particularly suitable for portable applications such as mobile phones and mobile phone accessories, laptops, desktops, and servers. The diode can also be used for applications with laser diode protection and analog input. **μClamp ™ Functions and advantages of transient voltage suppressor diode * * Transient protection, used for data lines, compliant with IEC 61000-4-2 (ESD) ± 15kV (air), ± 8kV (contact) IEC 61000-4-4 (EFT) 40A (tp=5/50ns) Cable discharge event (CDE) Ultra small package (1.0 x 0.6 x 0.5mm) Low leakage current solid-state silicon avalanche technology # # Transient voltage suppressor, Semtech
Product QR code
Brand: Semtech Corporation
Packaging XFDFN-3
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
2.55  yuan 2.55yuan
5+:
$ 3.4358
25+:
$ 3.1813
50+:
$ 3.0031
100+:
$ 2.9268
500+:
$ 2.8759
2500+:
$ 2.8122
5000+:
$ 2.7868
10000+:
$ 2.7486
Quantity
5+
25+
50+
100+
500+
Price
$3.4358
$3.1813
$3.0031
$2.9268
$2.8759
Price $ 3.4358 $ 3.1813 $ 3.0031 $ 2.9268 $ 2.8759
Start batch production 5+ 25+ 50+ 100+ 500+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(5082) Minimum order quantity(5)
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Technical parameters/number of channels: 1

Technical parameters/clamp voltage: 12.5 V

Technical parameters/peak pulse power: 25 W

Technical parameters/operating temperature (Max): 85 ℃

Technical parameters/operating temperature (Min): -40 ℃

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 2

Encapsulation parameters/Encapsulation: XFDFN-3

External dimensions/length: 1.1 mm

External dimensions/width: 0.7 mm

External dimensions/height: 0.38 mm

External dimensions/packaging: XFDFN-3

Physical parameters/operating temperature: -40℃ ~ 85℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Tape & Reel (TR)

Other/Manufacturing Applications: Data lines for mobile devices

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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