Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A001
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
7132LA55C
|
Integrated Device Technology | 功能相似 | DIP-48 |
静态随机存取存储器 16K(2KX8)CMOS DUALPORT RA
|
||
|
|
Integrated Device Technology | 功能相似 | DIP-48 |
静态随机存取存储器 16K(2KX8)CMOS DUALPORT RA
|
||
IDT7132LA55P
|
Integrated Device Technology | 功能相似 | DIP |
HIGH -SPEED 2K ×8双端口静态对中断RAM HIGH-SPEED 2K x 8 DUAL-PORT STATIC RAM WITH INTERRUPTS
|
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