Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
X24C44P
|
Xicor | 功能相似 | DIP |
Serial Nonvolatile Static RAM 8P DIP
|
||
X24C44P
|
Intersil | 功能相似 | DIP-8 |
Serial Nonvolatile Static RAM 8P DIP
|
||
X24C44PI
|
Xicor | 功能相似 | DIP |
Serial Nonvolatile Static RAM
|
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