Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS276S
|
Maxim Integrated | 功能相似 | SOIC-8 |
Single Transmitter/Receiver RS-232 8Pin SOIC
|
||
DS276S+T&R
|
Maxim Integrated | 功能相似 | SOIC-8 |
IC TXRX LOW POWER RS-232 8-SOIC
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review