Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS2436Z+T&R
|
Maxim Integrated | 功能相似 | SOIC |
Battery Management
|
||
DS2436Z/T&R
|
Maxim Integrated | 功能相似 | SOIC |
Battery Management
|
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