Technical parameters/access time: 100 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/length: 27 mm
External dimensions/width: 27 mm
External dimensions/height: 7.77 mm
External dimensions/packaging: BGA-256
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS2030L-100#
|
Maxim Integrated | 完全替代 | BGA-256 |
IC NVSRAM 256Kbit 100NS 256BGA
|
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