Technical parameters/number of circuits: 1
Technical parameters/resistance: 50.0 kΩ
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: Flip-Chip-8
External dimensions/packaging: Flip-Chip-8
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
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